Call for Applications: 2026 Hong Kong Polytechnic University (PolyU) Summer Internship Program (Deadline: Feb 23)
Release date:2026/02/02
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I. Program Information
- Duration: July to August 2026 (approximately 4–8 weeks, depending on the host unit).
- Fields: Opportunities cover Electrical & Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Health Technology & Informatics, and more. For details regarding host departments, project topics, supervisors, and skill requirements, please refer to the PolyU Job Lists 2026.
- Stipend: Selected students will receive a monthly living allowance of HKD 11,730 to cover airfare, accommodation, and living expenses in Hong Kong.
- Credit Transfer: Eligibility for off-campus internship credit transfer depends on the regulations of the student's specific department or college.
- Current CGU undergraduate students. Good English proficiency is recommended.
- Applicants must meet the background and skill requirements listed for each specific internship position.
- Online Application: Please complete the form at 2026 PolyU Summer Internship Program Application Form.
- Required Documents (Upload as PDF):
- Mandatory: CV (in English), Cover Letter (in English), and Academic Transcript of Fall 2025 (114-1 Semester) including class ranking.
- Optional: Proof of English proficiency (e.g., TOEIC, IELTS, TOEFL).
- Application Deadline: February 23, 2026 (Monday) before 23:59.
- Note: Please ensure all application documents are complete. Incomplete applications will be considered invalid and will not be processed.
If you have any questions, please contact Ms. Lin at the Office of International Affairs.
- Extension: 3536
- Email: lyh@gap.cgu.edu.tw