奈米工程及設計碩士學位學程

一、 演講主題：「Preparation and Dispersion of Cu Nanoparticles for Semiconductor Packaging」
二、 主講人：Prof. Tetsu Yonezawa (米澤 徹 教授)
日本北海道大學 材料科學部門 教授
三、 摘要：
Copper nanoparticles are promising for next-gen interconnects due to high conductivity and low-cost processing. However, oxidation under ambient conditions limits their performance. We present oxidation-tolerant core–shell Cu nanoparticles with Cu64O/Cu8O-rich surfaces, enabling thermal stability and sinterability. Using sugar alcohol-based solvents, we formulate >80 wt% copper pastes with excellent dispersion and film-forming properties. Thermal analysis, in situ XRD, and sintering studies show strong bonding and conductivity below 200°C under reducing/inert atmospheres. This approach suits 3D integration, power devices, and flexible electronics, offering a practical route for copper nanoparticle use in semiconductor packaging with enhanced reliability and low-temperature processing.
四、演講關鍵詞：Copper nanoparticles, Low-temperature sintering, Oxidation control, Electronic packaging, High-concentration paste
五、 日期：2025/10/15(三) 14:30~16:00
六、 地點: 工學大樓1樓工學院第一會議室
七、 報名截止日：10/14(二)
敬請本校師生踴躍報名參加。本校教職員生欲參與者請登入校務資訊系統iCGU「活動報名系統」報名！

注意事項：
此次演講可認列教學品質研討會研習時數1.5小時，為對演講者表示尊重，請現場與會教研人員全程參加並親自簽到、簽退，逾開始時間20分鐘恕不給予簽到，未完成簽退者，將無法納入研習時數。


公告單位：研發處永續發展與能源科技研究中心-校外經費
承辦人：邱姿螢

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